Polymer composition containing chlorided conductive particles

ABSTRACT

A composition comprising chlorided and non-chlorided conductive particles and polymeric material selected from the group of polymers, pre-polymers and mixtures thereof wherein at least about 5 percent by weight of the particles included in the composition have been subjected to treatment such that the particles have chloride at least on their surface prior to inclusion in the composition.

BACKGROUND OF THE INVENTION

The present invention relates to polymer compositions containingconductive particles and more particularly to polymer compositionscontaining metal-based conductive particles and chlorided metal-basedconductive particles in such a manner as to render the compositionsuitable for use as an electrode surface which is to be exposed to anaqueous environment, as an oxidizing source in intimate contact with aconductive material in a battery, or as a convenient source of silver intouch up electroplating systems.

Ink and plastic formulations have been employed in the past as coatings,layers or surfaces on electrode components. Such formulations as forexample described in U.S. Pat. No. 4,592,961 (Ehrreich), U.S. Pat. No.4,371,459 (Nazarenko), and U.S. Pat. No. 4,425,263 (Nazarenko), includehighly conductive particles for purposes of imparting conductivity tothe polymer based composition without regard to providing thecomposition with resistance to harsh or potentially degradativeenvironments and without regard to controlling the electroconductivityof the polymer composition against voltage drift or resistance increase,especially in a direct current environment.

The compositions of the invention are particularly useful as electrodecomponents or as coatings on electrode components which are to beexposed to aqueous environments such as in body electrodes, describedfor example in U.S. Pat. Nos. 3,976,055; 4,257,424; and 3,977,392, andas are otherwise commercially available. By coating an electrode surfacewith a composition according to the invention at least over the areawhich is to be exposed to an electroconductive aqueous environment, theelectrode may be protected from electrical degradation and may bestabilized as to electroconductivity.

In accordance with the invention there is provided a compositioncomprising conductive particles and polymeric material selected from thegroup of polymers, pre-polymers and mixtures thereof wherein at leastabout 5 percent by weight of the particles included in the compositionhave been subjected to treatment such that the particles have chlorideat least on their surface prior to inclusion in the composition. Inapplication where a liquid ink is desired, the composition may furtherinclude a solvent compatible with the polymeric material and the treatedparticles.

The particles preferably comprise a metal-based material selected fromthe group of noble metals, noble metal oxides, and mixtures thereof.

The conductive particles subjected to the pre-chloriding treatment aretypically either a noble metal or a noble metal oxide, and are typicallycoated at least on their surfaces with noble metal chloride as a resultof the chloriding treatment.

The noble metal particles selected are most preferably silver metalparticles and the noble metal oxides selected are most preferably silveroxide particles. The untreated particles included in the composition maybe a mixture of noble metal and noble metal oxide, and the chloridedparticles may be a mixture of chlorided noble metal particles andchlorided noble metal oxide particles. Preferably the untreatedparticles included in the composition are either a noble metal or anoble metal oxide and the treated particles are either a chlorided noblemetal or a chlorided noble metal oxide. Most preferably the untreatedand treated particles have the same noble metal base. And, typically,the untreated and treated particles are both noble metal-based or noblemetal oxide based.

Where a composition according to the invention is used as a coating on anon-conductive substrate, the composition includes at least enough noblemetal particles as are necessary to render the composition conductivewhen in a dry state, for example, an ink coated and dried on anon-conductive substrate.

The polymeric material of the composition is preferably selected fromthe group of polyesters, vinyl chloride copolymers, vinylidene chloridecopolymers, polyurethanes, ethylene copolymers, acrylate polymers,acrylate copolymers, and mixtures thereof. The solvent material, if any,of the composition is preferably selected from the group of ketones,esters, and mixtures thereof.

Most preferably the ratio of chlorided particles to untreated conductiveparticles included in the composition is selected such that thecomposition is or remains conductive.

Also in accordance with the invention there is provided a productcomprising a composition according to the invention coated on asubstrate. The substrate is a dimensionally stable material which istypically non-conductive but may also be conductive. Such coatings aretypically accomplished by coating an ink composition according to theinvention on a substrate and evaporating any solvent from the coating,e.g., by heating, air drying, or the like. Such coatings may beselectively coated on a suitable substrate in any desired pattern, e.g.,in a predetermined printed circuit-like pattern.

Further in accordance with the invention, there is provided a processfor making a conductive polymer composition comprising selecting asuitable polymeric material, selecting a suitable metal-based particlematerial, selecting a suitable metal-based particle material forchloriding, pre-chloriding the selected metal-based particle material,admixing the polymeric material, the metal-based particles and thepre-chlorided metal-based particles, and optionally admixing acompatible solvent.

Further in accordance with the invention, there is provided a processfor making a coated product comprising selecting a suitable substrate,selecting a metal-based particle material, subjecting the metal-basedparticle material to a pre-chloriding treatment such that the particleshave metal chloride at least on their surfaces, forming a homogeneoussolution comprising the selected polymeric material and a suitablesolvent, admixing the treated particles therewith to form a homogeneoussolution of the polymeric material and the treated particles, admixing anoble metal particle material with the solution at least when theselected substrate is nonconductive, optionally admixing a noble metalparticle material with the solution when the selected substrate isconductive, coating the admixed solution on the the substrate in apredetermined pattern or otherwise, and evaporating the solvent from thecoating on the substrate.

SUMMARY OF THE INVENTION

The present invention provides a novel composition containing anon-conductive polymer and a metal-based particle material. Themetal-based particle material typically comprises a mixture ofconductive metal-based particles and metal-based particles which havebeen pre-treated to form metal chloride at least on the surface of theparticles so treated. Such pre-chloriding treatment prior to inclusionof the particles in the composition allows the size of the particles tobe maintained, thus avoiding agglomeration or fusion of metal chlorideand thus allows the chlorided particles to be homogeneously dispersed inthe polymer composition rendering the composition more readily coatablewhen in the form of an ink and renders it a better conductor.

The metal-based particles are typically a noble metal or noble metaloxide. The chloriding pre-treatment is typically carried out on theselected metal-based material by subjecting the metal-based material totreatment with a metal chloride-forming solution, such as aqueoussolutions of sodium hypochlorite, ferric chloride, sodium chloride orpotassium chloride. Other conventional metal chloride-forming agents maybe employed depending on the particular metal-based material to bechlorided. The metal-based material may be used in any conventionalparticle form, such as flake, spherical, granular, chopped filament, orother powder forms. The maximum length of a particle in any onedimension is preferably less than about 0.25 inches.

For example, where silver flake or powder is selected as the metal-basedmaterial, the silver is typically chlorided by subjecting the silver totreatment with a sodium hypochlorite or ferric chloride aqueous solutionat a concentration and temperature and for a period of time at leastsufficient to form a silver chloride layer on the surface of the treatedparticles (powder or flake). Where silver oxide is, for example,selected as the metal-based particle material, it is typically chloridedwith an aqueous sodium chloride or potassium chloride solution. Whateverchloriding treatment process is employed, it is carried out at aconcentration and temperature and for a time sufficient to form metalchloride at least on the surface of the selected metal-based material.

The composition of the untreated and treated metal-based material whichis ultimately combined with the polymeric material may comprise amixture of more than one noble metal-based material and more than onechlorided metal-based material. Where a mixture of noble metal-basedmaterials is used, the materials are selected to be compatible with eachother, at least such that corrosion of the particles will not occur. Themetal-based material added to the polymeric material typically comprisesa single noble metal-based material such as silver/chlorided silver,silver/chlorided silver oxide, silver oxide/chlorided silver oxide,silver oxide/chlorided silver, and the like. The chlorided particles arehomogeneously dispersed throughout the composition.

The untreated and treated metal-based materials which are to be combinedwith the polymeric material may be premixed and added as a homogeneousmixture of untreated metal-based material and chlorided metal-basedmaterial, to the polymeric material. Typically, the untreated andchlorided metal-based materials are separately added to andhomogeneously mixed with the polymeric material. For example, aconventional untreated metal-containing polymer composition, such as acommercially available conductive ink or plastic, may be modified toachieve a composition according to the invention by, for example,removing preferably all or less preferably a portion of the conductiveparticles from the commercial composition, and admixing therewithmetal-based particles which have been pre-chlorided and preferablyadmixing untreated conductive particles.

Removal of all or a portion of the conductive particles from acommercial preparation may be carried out in any conventional manner.For example with respect to a commercial ink composition, thecomposition may be allowed to settle over relatively long periods oftime, or may be centrifuged to more quickly remove the conductiveparticles therefrom with the addition of a suitable solvent in order topre-dilute the preparation, if necessary, to aid in the removal of thedesired amount of particles. Other conventional means may be employedsuch as filtration to remove a desired amount of conductive particlesfrom commercially available preparations for purposes of replacementwith chlorided particles. Alternatively, a desired amount ofpre-chlorided and untreated metal-based material may simply be added tocommercial solutions.

Whether the ultimate composition according to the invention ismanufactured solely from individual starting materials or is attained bymodifying known, commercially available compositions, the object of theinvention is to obtain a polymeric material combined with a pre-selectedratio of untreated, metal-based material and pre-chlorided, metal-basedparticle material, with the untreated and treated metal-based materialsbeing homogeneously dispersed throughout the composition. Mostpreferably, treated metal-based material is at least 5% by weight of thetotal metal-based material in the composition and the treatedmetal-based material may comprise as much as 100% of the totalmetal-based material in the composition.

The ultimate polymer/metal-based material compositions according to theinvention may take the form of dimensionally stable plastics or inks,and are useful as, or in conjunction with, the construction ofelectrodes, particularly electrodes which are intended for use incontact with conductive, aqueous environments, such as body electrodes.

In embodiments of the invention where the composition is made into theform of an ink, a suitable solvent is combined with the polymericmaterial and the metal-based material. Such solvents are typicallyselected on the basis of their compatibility with the polymermaterial(s) selected for use in the inventive composition. Inasmuch asthe purpose of an ink composition is typically for its application tothe surface of a substrate, preferred polymeric materials are thosewhich have good adhesion and binding properties when the solvent isevaporated. Examples of preferred polymeric materials for inclusion in acomposition according to the invention are polyesters, vinyl chlorideco-polymers, vinylidene chloride co-polymers, polyurethanes, ethyleneco-polymers, acrylate polymers, and acrylate co-polymers. Typicalsolvents which may be useful in conjunction with one or more of suchpolymers are ketones such as acetone, methyl ethyl ketone, isophorone,and the like; esters such as a dibasic ester (e.g., DBE, E.I. DuPont deNemours, Wilmington, Del.), propylene glycol methyl ether acetate,2-ethoxyethylacetate, and the like. Mixtures of two more of theforegoing polymers and mixtures of two or more of the foregoing solventsmay also be employed depending upon the compatibility of the polymersand solvents selected.

Ink compositions according to the invention may be applied as a uniformlayer across the entire surface of an electrode component substrate ormay be selectively coated on selected areas of the surface in a patternso as to render certain areas conductive, partially conductive, ornon-conductive, as desired. Selective coating on an electrode componentsurface may be desired, for example, to selectively coat one area whichis intended to come in contact with a conductive, aqueous environmentand insulate that area from another area of the electrode surface by notcoating that area. Coating of an electrode component surface, selectiveor otherwise, may be achieved in any conventional manner, such as byscreen printing; reverse roll coating (pan- or nip-fed); knife-over rollcoating; gravure coating (direct or offset); embossed roll coating;Mayer rod coating; curtain coating; and the like.

Electrode components which may be coated with ink compositions accordingto the invention, typically comprise a dimensionally stablenon-conductive inert plastic substrate (rigid or flexible), such as apolycarbonate, polyester, polyvinyl, or other inert polymer. In someapplications, an electrode component acting as a substrate for the inksof the invention may itself be conductive. In such applications where aninert, non-conductive plastic is employed to comprise the substrate, oneor more conductive fillers may be admixed with the plastic to render theelectrode substrate conductive, such as conductive metal flakes andpowders, carbon or graphite powders and filaments and the like.Alternatively, in such applications the electrode substrate may compriseany suitable dimensionally stable, conductive material such as acorrosion resistant metal.

In applications where an ink composition according to the invention iscoated on a conductive electrode component substrate, the degree ofconductivity of the ink composition, once applied, may be less or morethan the conductivity of the substrate itself, with the ink formulationacting as a protective surface-coating and also as a stabilizing surfacewhich limits the amount of drift in electrical measurements which may berecorded with the component.

DETAILED DESCRIPTION OF EXEMPLARY PREFERRED EMBODIMENTS OF THE INVENTION

The following discussion sets forth exemplary procedures for preparing avariety of exemplary compositions according to the invention.

Pre-Treatment with Sodium Hypochlorite (NaOCl)

A. 160 grams of Silver Flake #65 (Metz Metallurgical Corporation,Ridgefield, N.J.) was admixed with 400 ml of denatured alcohol(primarily ethanol containing a small amount of methanol) and then, withmixing, quickly added 1600 ml of regular Clorox® bleach (5.25% NaOCl inwater; (Clorox Corporation., Oakland, Calif.), and continued mixing withmechanical agitation was carried out for about three minutes. Thechloride coated silver particles were then allowed to settle and thesupernatant liquid decanted off.

B. One gallon of tap water was added to the treated particles obtainedin Step A, the mixture was mechanically agitated, the particles allowedto settle and the liquid supernatant then decanted off. The sameprocedure was repeated once again.

C 1200 ml of acetone was added to the particles obtained from Step B,the mixture was mechanically agitated, the particles allowed to settle,and the liquid supernatant decanted off. This procedure was repeatedthree times.

EXAMPLE I

Conductive ink E-1700 (a silver flake/polymer/solvent compositionavailable from Ercon, Inc., Waltham, Mass.) was centrifuged to separatesome of the polymer solution from the silver flake therein. 334 grams ofthis separated polymer solution was added to and admixed with all of thetreated particle material obtained from Step C of the chloridingpre-treatment described above containing 200 grams of retained acetone.Then 340 grams of untreated Silver Flake #65 was admixed with thepolymer/treated particle/acetone mixture.

The resulting ink, unlike conventional E-1700, when incorporated into abody electrode, like that described in U.S. Pat. No. 3,977,392, will notresult in large voltage drifts in direct current environments.

The resulting ink was screen-printed with a 305 polyester mesh screenonto a 5 mil thick ICI 505 polyester sheet and dried in an oven for 0.5hours at 97° C. The dried ink layer exhibited a resistance of 1.6ohms/sq.

EXAMPLE II

Steps A, B and C of the above-described pre-chloride treatment werecarried out on 160 grams of Silver Flake #7 (Metz MetallurgicalCorporation, So. Plainfield, N.J.).

100 grams of VAGH, a vinyl chloride co-polymer (Union CarbideCorporation, New York, N.Y.) was dissolved in 400 grams of Isophorone.

334 grams of the VAGH/Isophorone solution was admixed with all of thechlorided Silver Flake #7 in 300 grams of retained acetone solvent fromStep C of the chloriding treatment. To this admixture 340 grams ofuntreated Silver Flake #7 was added and admixed to obtain another inkcomposition according to the invention.

EXAMPLE III

Steps A, B and C of the above-described chloriding treatment was carriedout on 80 grams of Silver Flake 50-S (Metz Metallurgical Corporation).

320 grams of polymer solution from E-1700 conductive ink was obtained bycentrifuging.

All of the pre-chlorided Silver Flake 50-S in 244 grams of retainedacetone from Step C was mixed with the 320 grams of the polymer solutionobtained from E-1700 to obtain another conductive ink according to theinvention.

EXAMPLE IV

Steps A, B and C of the above-described pre-chloriding treatment werecarried out on 160 grams of Silver Powder C-200 (Metz MetallurgicalCorporation).

To the resulting pre-chlorided Silver powder C-200, 1200 ml of MEK(methyl ethyl ketone) was added, admixed and decanted off.

All of the treated Silver Powder C-200 contained 188 grams of theretained MEK as a result of the wash procedure described. To thiscombination was added and admixed 268 grams of 25 weight percentpolyester Vitel PE 200 (Goodyear Tire & Rubber Company, Akron, Ohio)dissolved in dibasic ester solvent, DBE (E.I. DuPont Nemours,Wilmington, Del.) and 340 grams of untreated Silver Flake #7. Anotherconductive ink according to the invention was thus obtained.

EXAMPLE V

Steps A, B and C of the pre-chloriding treatment described above, werecarried out on 160 grams of silver coated glass beads, S-3000-S3(Potters Industries, Inc., Parsippany, N.J.).

320 grams of polymer solution from E-1700 was obtained by centrifuging.The beads obtained from Step C of the chloriding pre-treatment in 120grams of retained acetone from Step C were added to the 320 grams of thepolymer solution. Another conductive ink according to the invention wasthus obtained.

EXAMPLE VI

To 62.7 grams of particulate silver oxide, Ag₂ O (Metz MetallurgicalCorporation) dispersed in 105.3 grams of water with continuous mixingwas added 2000 ml of an aqueous solution of 3% by weight sodiumchloride. This admixture was mixed for about five minutes, theparticulate material was allowed to settle and the supernatant liquidwas decanted off.

To the resulting chlorided particulate material while mixing was added2000 ml of an aqueous solution of 3% by weight sodium chloride. Thisadmixture was mixed for about three minutes, the particulate materialallowed to settle, and the supernatant liquid decanted off. Thistreatment with 3% sodium chloride was repeated.

To the resulting particulate material was added 2000 ml of tap water.This admixture was mixed for about sixty seconds, the particulatematerial allowed to settle, and the supernatant liquid decanted off.This tap water wash treatment was repeated three times.

To the resulting particulate material was added 500 ml of acetone. Thisadmixture was mixed for about sixty seconds, the particulate materialallowed to settle, and the supernatant liquid decanted off. This acetonewash treatment was repeated three times. On the last acetone wash onlyso much of the acetone was decanted off as to leave behind a totalacetone/wet chlorided particle mixture weiqhinq 100 grams.

80 grams of polymer solution from E-1700 ink was obtained bycentrifuging. The 80 grams of the polymer solution from E-1700 was addedto and admixed with the 100 grams of the acetone/wet chlorided particles(chlorided, washed, rinsed, and decanted) and 62 grams of Silver Flake#65 (Metz Metallurgical Corporation). An ink composition according tothe invention was thus obtained.

EXAMPLE VII

A 5 mil thick sheet of ICI 505 polyester film was selected. On a 5"×8"area of the surface of the polyester film, a conventional conductiveink, E-1400 (a polymer/silver flake/solvent composition commerciallyavailable from Ercon, Inc., Waltham, Mass.) was screen coated with a 305polyester mesh screen. The resulting screen coated film was dried in anoven for 0.5 hours at 97° C. The resulting product polyester film with adried, highly conductive polymer/silver flake coating adhered theretoover a 5"×8" area. The resistance of the dried coating was 0.08 ohm/sq.

The ink composition obtained by the procedure of Example III above, wasthen knife-coated on top of the 5"×8" dried E-1400 coating of theresultant film described above. The knife-coating covered only a 5"×4"area and was selectively coated in a pattern of stripes 0.75" wide,spaced 0.75" apart. The knife-coated product was then dried in an ovenfor about 0.5 hours at 97° C. The resistance of the dried knife-coatedcoating was 0.33 ohms/sq.

The resulting product was a successfully coated substrate having ahighly conductive coating adhered to the surface of the substrate andanother coating of polymer/chlorided silver composition selectivelyadhered in a pattern to the outer surface of the highly conductivecoating. The various coating operations of this example were easilycarried out and more complicated patterns of coating could also havebeen readily carried out by conventional coating procedures, such asknife coating, screen coating and the like.

I claim:
 1. A composition comprising chlorided and non-chloridedconductive particles and organic material selected from the groupconsisting of polymers, pre-polymers and mixtures thereof wherein atleast about 5 percent by weight of the particles included in thecomposition are particles which were formed and subsequently chloridedprior to inclusion in the composition such that the particles have noblemetal chloride at least on their surface prior to inclusion in thecomposition.
 2. The composition of claim 1, further comprising acompatible solvent.
 3. The composition of claim 1, wherein the particlescomprise a metal-based material selected from the group consisting ofnoble metals, noble metal oxides and mixtures thereof
 4. The compositionof claim 2, wherein the particles comprise a metal-based materialselected from the group consisting of noble metals, noble metal oxidesand mixtures thereof.
 5. The composition of claim 1, wherein the atleast about 5 percent of the particles are coated with a noble metalchloride by the chloriding treatment.
 6. The composition of claim 2,wherein the at least about 5 percent of the particles are coated with anoble metal chloride by the chloriding treatment.
 7. The composition ofclaim 3, wherein the at least about 5 percent of the particles arecoated with a noble metal chloride by the chloriding treatment.
 8. Thecomposition of claim 1, wherein the particles subjected to the treatmentprior to inclusion in the composition comprise metal-based particlesselected from the group consisting of noble metals and noble metaloxides.
 9. The composition of claim 2, wherein the particles subjectedto the treatment prior to inclusion in the composition comprisemetal-based particles selected from the group consisting of noble metalsand noble metal oxides.
 10. The composition of claim 3, wherein theparticles subjected to the treatment prior to inclusion in thecomposition comprise metal-based particles selected from the groupconsisting of noble metals and noble metal oxides.
 11. The compositionof claim 5, wherein the particles subjected to the treatment prior toinclusion in the composition comprise metal-based particles selectedfrom the group consisting of noble metals and noble metal oxides. 12.The composition of claim 7, wherein the particles subjected to thetreatment prior to inclusion in the composition comprise metal-basedparticles selected from the group consisting of noble metals and noblemetal oxides.
 13. The composition of claim 3, wherein the noble metaloxide is silver oxide.
 14. The composition of claim 7, wherein the noblemetal oxide is silver oxide.
 15. The composition of claim 12, whereinthe noble metal oxide is silver oxide.
 16. The composition of claim 12,wherein the particles subjected to the treatment prior to inclusion inthe composition are silver oxide and the noble metal chloride is silverchloride.
 17. The composition of claim 1, wherein the particlessubjected to the treatment prior to inclusion in the composition aresilver oxide subjected to the treatment with chloride.
 18. Thecomposition of claim 2, wherein the particles subjected to the treatmentprior to inclusion in the composition are silver oxide subjected to thetreatment with chloride.
 19. The composition of claim 1, wherein theorganic material is selected from the group consisting of polyester,vinyl chloride copolymers, vinylidene chloride copolymers, polyurethane,ethylene copolymers, acrylate polymers, acrylate copolymers and mixturesthereof.
 20. The composition of claim 2, wherein the organic material isselected from the group consisting of polyester, vinyl chloridecopolymers, vinylidene chloride copolymers, polyurethane, ethylenecopolymers, acrylate polymers, acrylate copolymers and mixtures thereof.21. The composition of claim 3, wherein the organic material is selectedfrom the group consisting of polyester, vinyl chloride copolymers,vinylidene chloride copolymers, polyurethane, ethylene copolymers,acrylate polymers, acrylate copolymers and mixtures thereof.
 22. Thecomposition of claim 5, wherein the organic material is selected fromthe group consisting of polyester, vinyl chloride copolymers, vinylidenechloride copolymers, polyurethane, ethylene copolymers, acrylatepolymers, acrylate copolymers and mixtures thereof.
 23. The compositionof claim 8, wherein the organic material is selected from the groupconsisting of polyester, vinyl chloride copolymers, vinylidene chloridecopolymers, polyurethane, ethylene copolymers, acrylate polymers,acrylate copolymers and mixtures thereof.
 24. The composition of claim2, wherein the solvent is selected from the group consisting of ketones,esters and mixtures thereof.
 25. The composition of claim 4, wherein thesolvent is selected from the group consisting of ketones, esters andmixtures thereof.
 26. The composition of claim 20, wherein the solventis selected from the group consisting of ketones, esters and mixturesthereof.
 27. The composition of claim 1, wherein the composition isconductive.
 28. The composition of claim 16, wherein the composition isconductive.
 29. The composition of claim 2, wherein the composition isconductive upon evaporation of the solvent from the composition.
 30. Thecomposition of claim 18, wherein the composition is conductive uponevaporation of the solvent from the composition.
 31. The composition ofclaim 4, wherein the particles subjected to the treatment prior toinclusion in the composition are coated with a noble metal chloride bythe chloriding treatment.
 32. The composition of claim 31, wherein theorganic material is selected from the group consisting of polyester,vinyl chloride copolymers, vinylidene chloride copolymers, polyurethane,ethylene copolymers, acrylate polymers, acrylate copolymers and mixturesthereof.
 33. The composition of claim 32, wherein the solvent isselected from the group consisting of ketones, esters and mixturesthereof.
 34. The composition of claim 1, wherein the particles comprisea metal-based material selected from the group consisting of silver,silver oxide and mixtures thereof.
 35. The composition of claim 34,wherein the particles subjected to the treatment prior to inclusion inthe composition are silver particles.
 36. The composition of claim 34,wherein the particles subjected to the treatment prior to inclusion inthe composition are silver oxide particles.
 37. The composition of claim35 wherein the particles included in the composition comprise silverparticles and silver particles subjected to the treatment prior to theirinclusion in the composition.
 38. The composition of claim 36 whereinthe particles included in the composition comprise silver particles andsilver oxide particles subjected to the treatment prior to theirinclusion in the composition.
 39. The composition of claim 35 whereinthe particles included in the composition comprise silver oxideparticles and silver particles subjected to the treatment prior to theirinclusion in the composition.
 40. The composition of claim 36 whereinthe particles included in the composition comprise silver oxideparticles and silver oxide particles subjected to the treatment prior totheir inclusion in the composition.
 41. A composition comprisingchlorided and non-chlorided conductive particles selected from the groupconsisting of noble metal particles, noble metal oxide particles, noblemetal coated particles, and mixtures thereof and organic materialsselected from the group consisting of polymers, pre-polymers, andmixtures thereof wherein at least about 5% by weight of the particlesincluded in the composition are particles which were formed andsubsequently chlorided prior to inclusion in the composition such thatthe particles have noble metal chloride at least on their surface, priorto inclusion in the composition.
 42. A composition as claimed in claim41 wherein the organic material is selected from the group consisting ofpolyester, vinyl chloride copolymers, vinylidene chloride copolymers,polyurethane, ethylene copolymers, acrylate polymers, acrylatecopolymers and mixtures thereof.
 43. A composition as claimed in claim41 wherein the particles are chlorided using a noble metalchloride-forming solution.
 44. A composition as claimed in claim 42wherein the particles are chlorided using a noble metal chloride-formingsolution.
 45. A composition comprising chlorided and non-chloridedconductive particles and an organic material selected from the groupconsisting of polyester, vinyl chloride copolymers, vinylidene chloridecopolymers, polyurethane, ethylene copolymers, acrylate polymers,acrylate copolymers and mixtures thereof wherein at least about 5% byweight of the particles included in the composition are particles whichwere formed and subsequently chlorided prior to inclusion in thecomposition such that the particles have noble metal chloride at leaston their surface prior to inclusion in the composition.
 46. Acomposition as claimed in claim 45 wherein the conductive particles areselected from the group consisting of noble metal particles, noble metaloxide particles, noble metal coated particles and mixtures thereof. 47.A composition as claimed in claim 45 wherein the particles are chloridedusing a noble metal chloride-forming solution.
 48. A composition asclaimed in claim 46 wherein the particles are chlorided using a noblemetal chloride-forming solution.
 49. A composition as claimed in any oneof claims 1, 3, 13, 16 or 41 wherein the particles are flakes.
 50. Acomposition as claimed in any one of claims 1, 3, 13, 16 or 41 whereinthe particles are homogeneously dispersed in the organic material.
 51. Acomposition as claimed in any one of claims 1, 3, 13, 16 or 41 whereinabout 5% of the particles have noble metal chloride at least on theirsurface prior to inclusion in the composition.
 52. A combination of acomposition and a non-chlorided conductive material, comprising:a firstcomposition comprising conductive particles and organic materialselected from the group consisting of polymers, pre-polymers andmixtures thereof wherein at least about 5 percent by weight of theparticles included in the composition are particles which were formedand subsequently chlorided prior to inclusion in the composition suchthat the particles have noble metal chloride at least on their surfaceprior to inclusion in the composition; and a second non-chloridedconductive material in contact with the first composition.
 53. Acombination of a composition and a conductive material as claimed inclaim 52 wherein the composition further comprises a compatible solventand the composition is in contact with the conductive material uponevaporation of the solvent from the composition.
 54. A combination asclaimed in any one of claims 52-53 wherein the substrate is conductive.55. A conductive composition comprising chlorided and non-chloridedconductive particles and organic material selected from the groupconsisting of polymers, pre-polymers and mixtures thereof wherein atleast about 5 percent by weight of the particles included in thecomposition are particles which were formed and subsequently chloridedprior to inclusion in the conductive composition such that the particleshave noble metal chloride at least on their surface prior to inclusionin the conductive composition.
 56. The conductive composition of claim55, wherein the particles comprise a metal-based material selected fromthe group consisting of noble metals, noble metal oxides and mixturesthereof.
 57. The conductive composition of claim 55, wherein the atleast about 5 percent of the particles are coated with a noble metalchloride by the chloriding treatment.
 58. The conductive composition ofclaim 56, wherein the at least about 5 percent of the particles arecoated with a noble metal chloride by the chloriding treatment.
 59. Theconductive composition of claim 56, wherein the particles subjected tothe treatment prior to inclusion in the composition are silver oxide andthe noble metal chloride is silver chloride.
 60. The conductivecomposition of claim 55, wherein the polymeric material is selected fromthe group consisting of polyester, vinyl chloride copolymers, vinylidenechloride copolymers, polyurethane, ethylene copolymers, acrylatepolymers, acrylate copolymers and mixtures thereof.
 61. The conductivecomposition of claim 56, wherein the polymeric material is selected fromthe group consisting of polyester, vinyl chloride copolymers, vinylidenechloride copolymers, polyurethane, ethylene copolymers, acrylatepolymers, acrylate copolymers and mixtures thereof.
 62. A conductorcomposition comprising chlorided and non-chlorided conductive particlesand organic material selected from the group consisting of polymers,pre-polymers and mixtures thereof wherein at least about 5 percent byweight of the particles included in the composition are particles whichwere formed and subsequently chlorided prior to inclusion in thecomposition such that the particles have noble metal chloride at leaston their surface prior to inclusion in the composition.
 63. Acomposition as claimed in any one of claims 41, 45, and 52, wherein thecomposition is conductive.
 64. A composition as claimed in claim 63wherein the organic material is a polyester.